Solutions

Miniaturization & Increasing Density

With conventional micro-via forming techniques, it was necessary to use a resin material that did not contain glass cloth. It has been reported that the resulting difference in thermal expansion rates between the board and mounted components has caused stress-induced failures. At OKI Circuit Technology, we have developed a hyper-performance via system named Hiper Via, This system enables the use of conventional materials containing glass cloth using a micro-via forming technique that utilizes UV-YAG lasers. This makes it possible to ensure the same level of reliability as conventional engineering techniques. The system also enables layer 1-3 and 1-4 connections, achieving a high wiring capacity. As an example, it is possible to draw wiring from a 0.5 mm pitch, 256-pin CSP full grid.

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