Products

High Speed / High Frequency

Ultra high speed and high frequency transmission PCB

We provide the optimum Via structure for GHz compatible PCB.

Action

Reduces the difference between the characteristic impedance value of signal wiring and the characteristic impedance value of Via.

Effect

  1. Uniformization of signal propagation speed
  2. Reduces the amount of reflection and attenuation of the transmission line

Via processing method

Establishment of back drill method

Used for high-speed transmission-compatible backplanes and other high-thickness PCB.

Specification example

Effect of Via stub removal method (back drill)

Eliminate the drawbacks of TH mounting connectors

The disadvantage of TH mounting connector

Impact on the electrical characteristics of Via stubs

The larger the difference between the characteristic impedance values of the Via part and the wiring, the greater the amount of reflection / attenuation.
<Wiring conditions> Wiring length = 100 mm, number of vias = 2.

TDR measurement result(50mV/div)

32Gbps High-speed transmission PCB

PCBs for 32Gbps/lane signal transmission by combination of design, material and manufacturing technology, and 40Gbps/lane in near future.

Features

  • Supports PCB specification design by various simulations and experiment data
  • Material, structure, and process proposal for minimum product cost
  • Measurement of insertion loss

Applications

  • Enterprise Servers, IP Network Switching Routers, etc.

Overview

32Gbps High-speed transmission PCB

32Gbps High-speed transmission PCB

32Gbps High-speed transmission PCB

  • Example: 32G bps mid plane PCB
  • Layer: 18
  • PCB thickness: 4.0mm
  • Size: 508 x 428mm
  • Base material: Megtron6, Megtron7
  • Characteristics:SE 50ohm ±10%
  • Diff 85Ω±7% @10Gbps
  • Diff 85Ω±5% @25Gbps
  • Back drill: 6 types from each side

Total impedance controlled PCB

We are specialists in high-speed circuit multilayer boards

We began our business developing high-speed circuit boards for OKI's telecommunications carrier business. Building from that start, we have more than 15 years of experience developing and manufacturing impedance control boards. Leveraging the expertise and massive database that we have developed over this period, we propose printed boards with structures best suited to our customers' designs.

From design to board manufacture, OKI Circuit Technology board solutions are the most efficient solution both in terms of cost and lead-time from development to mass production.

Interstitial Via Hole (IVH) board

Interstitial Via Hole (IVH) board

OKI Circuit Technology Technologies
  • Board type: BWB for press-fit, IC tester board, etc.
  • Layers: up to 50
  • Size: 670 x 570 mm; max. Thickness: 6.3 mm max.
  • Characteristic impedance control: +/-5%
  • Materials: FR-4, FR-5, BT, Polyimide, Low dk
Product Specifications
  • Layers: 20
  • Structure: IVH, 10+10
  • Board thickness: 3.2 mm (.126")
  • Board size: 340 x 366.67 mm (13.39 x 14.44")
  • Line width/space OL: 0.127/0.110 mm (.005/.0043") IL 0.1/0.114 mm (.004/.0045")
  • Min. hole size (drill size) PTH: 0.35 mm (.0014"). IVH 0.25 mm (.001")
  • Surface finish: HASL
  • Material: High Tg FR-4
  • Characteristic impedance: Single-end 50 ohm +/-10%, differential 90 ohm +/-10%

IVH board - sequential lamination

IVH board - sequential lamination

OKI Circuit Technology Technologies
  • Enables high layer count
  • Enables many different IVH connections
  • Enables Characteristic Impedance Control
Product Specifications
  • Number of layers: 4 to 28
  • Board thickness: 0.5 (.020") to 4.2 (.165")
  • Minimum IVH diameter: 0.2 mm (.008")
  • Minimum land diameter: (OL) 0.5 mm (.020")
  • Minimum land diameter: (IL) 0.5 mm (.020")
  • Minimum line width: 0.075 mm (.003")
  • Minimum line space: 0.125 mm (.005")

PAD on VIA board

PAD on VIA board

OKI Circuit Technology Technologies
  • Capability of Resin-Filling
Product Specifications
  • Board size: 590 x 480 mm max.
  • Board thickness: 0.6 to 6.3 mm
  • Hole size: 0.35 mm/6.3 mm thick; 0.2 mm/3.5 mm thick
  • Pad-on-via: OK
  • Micro-via (bottomed) filling: 0.13 mm

Hiper Via board

Hyper Via board

Product Specifications
  • Layers: 16
  • Laser micro vias: L1-2, L2-3
  • Board thickness: 2.1 mm (.083")
  • Board size: 235 x 415 mm (9.25 x 16.34")
  • Line width/space: 0.10/0.10 mm (.004/.004")
  • Min. hole size (drill size): 0.3 mm (.0012")
  • Surface finish: Immersion silver
  • Material: High Tg FR-4
  • Characteristic impedance: 55 ohm +/-10%

Back-drill board

Back-drill board

Back-drill board

Product Specifications
  • Layers: 16
  • Laser micro vias: L1-2, L2-3
  • Board thickness: 2.1 mm (.083")
  • Board size: 235 x 415 mm (9.25 x 16.34")
  • Line width/space: 0.10/0.10 mm (.004/.004")
  • Min. hole size (drill size): 0.3 mm (.0012")
  • Surface finish: Immersion silver
  • Material: High Tg FR-4
  • Characteristic impedance: 55 ohm +/-10%

Back-drill board

Back-drill board

Product Specifications
  • Layers: 26
  • Laser micro vias: L1-2, L2-3
  • Board thickness: 2.1 mm (.083")
  • Board size: 235 x 415 mm (9.25 x 16.34")
  • Line width/space: 0.10/0.10 mm (.004/.004")
  • Min. hole size (drill size): 0.3 mm (.0012")
  • Surface finish: Immersion silver
  • Material: High Tg FR-4
  • Characteristic impedance: 55 ohm +/-10%

Contact

Contact