We introduce high-reliability substrates for space and defense,
high heat dissipation substrates, rigid-flexible substrates,
and substrates for various applications.
Introducing high-layer, high-definition,
high-speed transmission boards, and 5G and 6G
compatible boards used in communication equipment.
High accuracy required for various measuring instruments
Introducing high-resolution data transfer
and high-speed transmission boards
We introduce high heat dissipation substrates and rigid
flex substrates that support the infrastructure business.
We provide a consistent solution from
printed circuit board design to analysis,
manufacturing, and evaluation.
We will make reasonable proposals to customers from the latest technology