Products

High Density / Fine Pitch

High Density and Fine Pitch Design PCB

To enable the mounting of high-density and high-performance parts and the miniaturization of parts size

We provide high-density narrow-pitch boards using HDI structure and ultra-small hole drilling technology.


  • Fine Pitch Design PCB

  • Board Surface

  • X-ray fluoroscopy

  • Stack via: L1-2-3

  • Skip via: L1-3

PCB for narrow pitch BGA/CSP

High layer PCB for 0.35mm pitch, 1000 pin count BGA by FiTT (Fine pitch Through via Technology)

Features

  • Supports the test application PCBs for next-generation LSIs of 1000-pin 0.35mm pitch class
  • Shorter lead-time and lower-cost by employing simple through via structure
  • Stable connection to power supply or ground layers to secure higher quality signal transmission

Applications

  • Tester PCB for BGA package ICs
  • Socket boards, probe cards, etc.

Specifications

PCB for narrow pitch BGA/CSP

Over100Layer Advanced Super Multi-layer Rigid PCB

Ultra high layer (Over 100L) Rigid PCB with high electrical performance and high wiring capacity

Features

  • Over 100 layer count employing high Tg FR4 with conventional multi-layer process
  • Possible combination with various via structures such as IVH and micro-via
  • Original layout for characteristic impedance control and with low trace resistivity

Applications

  • LSI testers

Specifications

超高多層<100層超>リジット基板の写真

超高多層<100層超>リジット基板の写真

Contact

Contact