High Density / Fine Pitch
High Density and Fine Pitch Design PCB
To enable the mounting of high-density and high-performance parts and the miniaturization of parts size
We provide high-density narrow-pitch boards using HDI structure and ultra-small hole drilling technology.

Fine Pitch Design PCB

Board Surface

X-ray fluoroscopy

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PCB for narrow pitch BGA/CSP
High layer PCB for 0.35mm pitch, 1000 pin count BGA by FiTT (Fine pitch Through via Technology)
Features
- Supports the test application PCBs for next-generation LSIs of 1000-pin 0.35mm pitch class
- Shorter lead-time and lower-cost by employing simple through via structure
- Stable connection to power supply or ground layers to secure higher quality signal transmission
Applications
- Tester PCB for BGA package ICs
- Socket boards, probe cards, etc.
Specifications

Over100Layer Advanced Super Multi-layer Rigid PCB
Ultra high layer (Over 100L) Rigid PCB with high electrical performance and high wiring capacity
Features
- Over 100 layer count employing high Tg FR4 with conventional multi-layer process
- Possible combination with various via structures such as IVH and micro-via
- Original layout for characteristic impedance control and with low trace resistivity
Applications
Specifications

