Semiconductor Testing / ATE

Semiconductor technologies continue to advance. There is a need for high-precision processing technologies for multilayer/large testing boards to support larger wafers with large pin counts. There is also a need top-rate electrical characteristics, in order to support faster transmission signalling. High-precision/high-detail processing technologies are required to support decreasing package sizes.

We offer semiconductor testing boards, supporting from the background the reliable quality of continually evolving semiconductor devices.

Probe cards

OKI Circuit Technology Technologies

• We offer high-precision/multilayer boards supporting high pin counts.
• We offer high-spectrum boards supporting high pin counts with narrow pitch (0.65 mm).
• We reduce development cycles through parallel, simultaneous design and our special production readiness.

Product Specifications

• Layers: 4 to 40
• Aspect ratio: 21 (note: some variation in board thickness)
• Max. dimensions: 480 x 480 mm
• Board thickness: up to 6.3 mm
• Material: FR-4, FR-5 equivalent, polyimide
• Surface finish: electroless gold

Performance boards/DUT boards

OKI Circuit Technology Technologies

• We offer high-precision/multilayer boards supporting high pin counts.
• We offer high-spectrum boards supporting narrow pin pitch (0.5 mm).
• We provide transmission-channel simulation technologies and high-precision control of characteristic impedance, supporting top-rated electrical characteristics through high-speed signal transmission.
• We reduce development cycles through parallel, simultaneous design and our special production readiness.

Product Specifications

• Layers: 4 to 40
• Aspect ratio: 21 (note: some variation in board thickness)
• Max. dimensions: 488 x 630 mm
• Board thickness: up to 6.3 mm
• Material: FR-4, FR-5 equivalent, polyimide
• Structure: PTH, pad-on-via
• FBGAs supported to date: 0.5 mm, 0.65 mm, 0.8 mm
• Surface finish: electroless gold (up to 3 µm)

Printed Circuit Board using Sintering Paste for Via Bonding<180-layer 15mm thickness>

Realize ultra multilayer PCB (180 layers 15 thickness) by using conductive paste connection for Via bonding between substrate

Features

• Realize ultra-high layer PCB by stacking and connecting multi-layer PCB (Connect vias on the surface)
• Support exceeding 7.6 thickness PCM while conventional manufacturing process had limitations in terms of drill bit length and production line
• By increasing board thickness, we can now handle more than 124 layers
• In addition to ultra-high thickness and ultra-high layers, it is possible to expand wiring area in conjunction with IVH

Application example

• Semiconductor testing equipment Prove card

Product overview and specifications

Burn-in boards

OKI Circuit Technology Technologies

• We offer high-integration/large/multilayer boards supporting high pin counts (1,000-pin class).
• We offer high-precision large boards supporting narrow pin pitch (0.5 mm).

Product Specifications

• Layers: 2 to 14
• Max. dimensions: 482 x 623 mm
• Board thickness: 1.6 mm+
• Material: FR-4, FR-5 equivalent
• Surface finish: HASL/electroless gold/OSP
• Socket pitch: 0.5 mm+
• Structure: PTH, pad-on-via