In the field of electronic equipment, where high functionality, high speed, and high density are advancing, we provide printed circuit boards with specific functions for each application under an integrated system from AW design to manufacturing.

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  • Ultra high speed and high frequency transmission PCB
  • 32Gbps High-speed transmission PCB
    PCBs for 32Gbps / lane signal transmission by combination of design, material and manufacturing technology
  • Total impedance controlled PCB
    Provide one-stop control of impedance and delay time of the entire transmission line on a high-speed board
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  • High Density and Fine Pitch design PCB
    provide high-density narrow-pitch boards using HDI structure and ultra-small hole drilling technology
  • PCB for narrow pitch BGA / CSP
    High layer PCB for 0.35mm pitch, 1000 pin count BGA by FiTT (Fine pitch Through via Technology)
  • Over100Layer Advanced Super Multi-layer Rigid PCB
    Ultra high layer (Over 100L) Rigid PCB with high electrical performance and high wiring capacity
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  • Metal Core / Metal Base PCB
    By adopting a metal core and metal base, we provide PCB with high heat radiation
  • Thick Copper PCB
    We have superiority in thick copper etching technology and lamination technology.

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  • DIS / ATE board
    Provide high advanced technology and high quality of PCB for semiconductors that support the reliable quality of ever-evolving semiconductor devices.
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  • Flex-Rigid PCB
    Achieve 2-8 multi flexible layers with controlled impedance
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  • T-SEC-Board - Multiple Board Thickness PCB
    Achieve different board thickness on a single PCB

Others

• High-frequency applied PCB using low-dielectric material - can be combined with general materials
• Counterbore and cavity processing to improve downsizing and heat radiation
• Qualified by Japan Ministry of Defense and Japan Aerospace Exploration Agency (JAXA)
• Various evaluations and analyzes of printed circuit boards available – See "Solution" to find the detail

• Products
  • High Speed / High Frequency
  • High Density / Fine Pitch
  • High Current / High Heat Radiation
  • Semiconductor Testing / ATE
  • Flex-Rigid PCB
  • T-SEC-Board

Contact

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