We introduce high-reliability substrates for space and defense,
high heat dissipation substrates, rigid-flexible substrates,
and substrates for various applications.
Introducing high-layer, high-definition,
high-speed transmission boards, and 5G and 6G
compatible boards used in communication equipment.
High accuracy required for various measuring instruments
Introducing high-resolution data transfer
and high-speed transmission boards
We introduce high heat dissipation substrates and rigid
flex substrates that support the infrastructure business.

We provide a consistent solution from
printed circuit board design to analysis,
manufacturing, and evaluation.




We will make reasonable proposals to customers from the latest technology
May 11, 2026
December 3, 2025
Effective Heat Dissipation:OKI Circuit Technology’s Thermal Management Solutions
November 28, 2025