High Density / Fine Pitch board

Build-up board

Three-stage build-up board for mass production

Single-sided three-stage build & stack structure support improves wiring design flexibility
Compatible with narrow pitch BGAs up to 0.4 mm pitch

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  3-N-3 Build-up Structure
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  CSP0.4mm pitch

Build-up board

Multi-stage attempt - 4-stage build-up wiring board production example

Build-up board

High-frequency measuring instruments, PCBs for aerospace fields

Suppresses temperature rise when a large current is applied (improved heat dissipation)
Heat dissipation applications for high-frequency signal components
Improvement of properties in low dielectric materials & stubless structure (build-up)

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• 
  Build-up Structure

High Density and Fine Pitch Design PCB

To enable the mounting of high-density and high-performance parts and the miniaturization of parts size

We provide high-density narrow-pitch boards using HDI structure and ultra-small hole drilling technology.

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  Fine Pitch Design PCB
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  Board Surface
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  X-ray fluoroscopy

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  Stack via: L1-2-3
• 
  Skip via: L1-3

PCB for narrow pitch BGA/CSP

High layer PCB for 0.35mm pitch, 1000 pin count BGA by FiTT (Fine pitch Through via Technology)

Features

• Supports the test application PCBs for next-generation LSIs of 1000-pin 0.35mm pitch class
• Shorter lead-time and lower-cost by employing simple through via structure
• Stable connection to power supply or ground layers to secure higher quality signal transmission

Applications

• Tester PCB for BGA package ICs
• Socket boards, probe cards, etc.

Specifications

Over100Layer Advanced Super Multi-layer Rigid PCB

Ultra high layer (Over 100L) Rigid PCB with high electrical performance and high wiring capacity

Features

• Over 100 layer count employing high Tg FR4 with conventional multi-layer process
• Possible combination with various via structures such as IVH and micro-via
• Original layout for characteristic impedance control and with low trace resistivity

Applications

• LSI testers

Specifications